Search
Filters
Close

TANK-XM811

Fanless embedded system with 2 or 4 expansion slots, chipset Intel Q470 and 10th/11th gen. Intel Core processors (Comet Lake)
Caratteristiche
  • lntel® Core™ i5-12500TE 1.9GHz (up to 4.3GHz, 6-core, 35W TDP)
  • lntel® Core™ i7 -12700TE 1.4GHz (up to 4.6GHz, 12-core, 35W TDP)
  • 2 x 2.5G Ethernet ports
  • Multiple USB ports and serial ports
  • Multiple internal expansion boards for flexible selection
  • Various optional backplanes and chassis
  • CE/FCC compliant
Manufacturer: iEi Integration Corp.

ModelName

TANK-XM811

 

Chassis

Color

BlackC

Dimensions (WxDxH) (mm)

230.6 x 256.04 x 76.2

System Fan

Fanless

Chassis Construction

Extruded aluminum alloys

 

Motherboard

CPU

12th Gen Intel® Core™ CPU TDP 35/65W

Chipset

R680E

Memory

2 x SO-DIMM DDR4 3200 (8GB pre-installed) (up to 64GB)

Storage

HDDBay

1 x 2.5” SATA 6Gb/s HDD/SSD bay

 

I/OInterfaces

Ethernet

2 x RJ-45, 2 x I225V 2.5GbE (colay I225LM)

USB 3.2 Gen 2 (10Gb/s)

8

COM

2 x RS-232/422/485, 4 x RS-232

DigitalI/O

12-bit (6-in/6-out) DB15

Display Interface

1 x DP++, 1 x HDMI

 

InternalExpansions

 

M.2

1 x 2280 M-key (PCIe x4)

1 x 2230 A-key (USB+PCIe x1, supports vPRO)

Expansion Backplane

Optional

 

Power

Power Input

12 ~ 28V DC

Remote Power

1 x 2-pin

Power Consumption

12V @ 8.8A (Intel®Core™ i9-12900TE with 16GB memory)

 

Reliability

Mounting

Wallmount

 

Operating Temperature

-20°C ~ 60°C with air flow (CPU TDP35W &SSD)

-20°C ~ 50°C with air flow (CPU TDP65W &SSD), 10% ~ 95% non-condensing

Storage Temperature

-40°C ~ 85°C, 10% ~ 95%, non-condensing

Operating Shock

Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD)

Operating Vibration

MIL-STD-810G 514.6C-1 (with SSD)

Weight(Net/Gross)

3.33/3.7kg

Safety / EMC

CE/FCC

Watchdog Timer

Programmable 1 ~ 255 sec/min

OS

Supported OS

Windows®10/11 IoT Enterprise/ Linux

Download

ModelName

TANK-XM811

 

Chassis

Color

BlackC

Dimensions (WxDxH) (mm)

230.6 x 256.04 x 76.2

System Fan

Fanless

Chassis Construction

Extruded aluminum alloys

 

Motherboard

CPU

12th Gen Intel® Core™ CPU TDP 35/65W

Chipset

R680E

Memory

2 x SO-DIMM DDR4 3200 (8GB pre-installed) (up to 64GB)

Storage

HDDBay

1 x 2.5” SATA 6Gb/s HDD/SSD bay

 

I/OInterfaces

Ethernet

2 x RJ-45, 2 x I225V 2.5GbE (colay I225LM)

USB 3.2 Gen 2 (10Gb/s)

8

COM

2 x RS-232/422/485, 4 x RS-232

DigitalI/O

12-bit (6-in/6-out) DB15

Display Interface

1 x DP++, 1 x HDMI

 

InternalExpansions

 

M.2

1 x 2280 M-key (PCIe x4)

1 x 2230 A-key (USB+PCIe x1, supports vPRO)

Expansion Backplane

Optional

 

Power

Power Input

12 ~ 28V DC

Remote Power

1 x 2-pin

Power Consumption

12V @ 8.8A (Intel®Core™ i9-12900TE with 16GB memory)

 

Reliability

Mounting

Wallmount

 

Operating Temperature

-20°C ~ 60°C with air flow (CPU TDP35W &SSD)

-20°C ~ 50°C with air flow (CPU TDP65W &SSD), 10% ~ 95% non-condensing

Storage Temperature

-40°C ~ 85°C, 10% ~ 95%, non-condensing

Operating Shock

Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD)

Operating Vibration

MIL-STD-810G 514.6C-1 (with SSD)

Weight(Net/Gross)

3.33/3.7kg

Safety / EMC

CE/FCC

Watchdog Timer

Programmable 1 ~ 255 sec/min

OS

Supported OS

Windows®10/11 IoT Enterprise/ Linux