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TANK-870e-H110

Fanless embedded system with Intel H110 chipset and 6th/7th gen. Intel Core processors (Skylake and Kaby Lake)
Caratteristiche
  1. 6th/7th Gen Intel® Core™ processor 
  2. Intel® H110 chipset and DDR4 memory
  3. Support dual display VGA+HDMI
  4. On-board connector to power add-on cards
  5. Great flexibility for hardware expansion
Manufacturer: iEi Integration Corp.

Model Name

TANK-870e-H110

 

Chassis

Color

Dark silver purple + Silver

Dimensions (WxDxH) (mm)

132.6 x 255.2 x 190

System Fan

Fanless

Chassis Construction

Extruded aluminum alloys

 

Motherboard

 

CPU

7th Gen Intel® Core™ CPU &

Intel® Core™ i7-6700TE (2.4 GHz, quad-core, TDP=35W) Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)

Chipset

Intel® H110

 

System Memory

2 x 260-pin DDR4 SO-DIMM,

one 4 GB pre-installed (system max: 32GB)

Storage

Hard Drive

1 x 2.5'' SATA 6Gb/s HDD/SSD bay

 

I/O Interfaces

USB 3.2 Gen 1 (5Gb/s)

4

Ethernet

2 x RJ-45 PCIe GbE by RTL8111G controller

COM Port

2 x RS-232/422/485 (DB-9, w/ 2.5kV isolation protection)

Display

1 x VGA, 1 x HDMI 1.4

 

Resolution

VGA: Up to 1920 x1200@60Hz

HDMI: up to 3840 x2160@30Hz

Audio

1 x Line-out ; 1 x Mic-in

Wireless

1 x 802.11a/b/g/n/ac (optional)

 

Expansions

 

Backplane

3A: 1 x PCIe x16, 2 x PCI

3B: 1 x PCIe x16, 1 x PCIe x4, 1 x PCI

3C: 3 x PCI

 

PCIe Mini

1 x Full-size (PCIe/ USB 2.0)

1 x Full-size (PCIe/ USB 2.0/ SATA)

 

Power

 

Power Input

DC Jack: 9 V ~ 36 V DC

Terminal Block: 9 V ~ 36 V DC

Power Consumption

19 V@3.44 A (Intel® Core™ i7-6700TE with 8 GB memory)

Internal Power Connector

5V@3A or 12V@3A

 

Reliability

Mounting

Wall mount & DIN Rail

 

Operating Temperature

i7-6700TE -20°C ~ 50°C with air flow (SSD), 10% ~ 95%, non-condensing i5-6500TE -20°C ~ 60°C with air flow (SSD), 10% ~ 95%, non-condensing

 

Storage Temperature

-40ºC ~ 85ºC with air flow (SSD), 5% ~ 90%, non-condensing

Operating Shock

Half-sine wave shock 5G, 11ms, 100 shocks per axis

Non-Operating Shock

Half-sine wave shock 15G, 11ms, 100 shocks per axis

Operating Vibration

MIL-STD-810G 514.6C-1 (with SSD)

Non-Operation Vibration

Half-sind mode IEC-60068-2-06

Weight (Net/Gross)

4.2 kg/6.3 kg

Safety/EMC

CE/FCC/KC

 

OS

 

Supported OS

Microsoft® Windows® 8 Embedded, Microsoft® Windows® Embedded Standard 7 E, Microsoft® Windows® 10 IoT Enterprise

Model Name

TANK-870e-H110

 

Chassis

Color

Dark silver purple + Silver

Dimensions (WxDxH) (mm)

132.6 x 255.2 x 190

System Fan

Fanless

Chassis Construction

Extruded aluminum alloys

 

Motherboard

 

CPU

7th Gen Intel® Core™ CPU &

Intel® Core™ i7-6700TE (2.4 GHz, quad-core, TDP=35W) Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)

Chipset

Intel® H110

 

System Memory

2 x 260-pin DDR4 SO-DIMM,

one 4 GB pre-installed (system max: 32GB)

Storage

Hard Drive

1 x 2.5'' SATA 6Gb/s HDD/SSD bay

 

I/O Interfaces

USB 3.2 Gen 1 (5Gb/s)

4

Ethernet

2 x RJ-45 PCIe GbE by RTL8111G controller

COM Port

2 x RS-232/422/485 (DB-9, w/ 2.5kV isolation protection)

Display

1 x VGA, 1 x HDMI 1.4

 

Resolution

VGA: Up to 1920 x1200@60Hz

HDMI: up to 3840 x2160@30Hz

Audio

1 x Line-out ; 1 x Mic-in

Wireless

1 x 802.11a/b/g/n/ac (optional)

 

Expansions

 

Backplane

3A: 1 x PCIe x16, 2 x PCI

3B: 1 x PCIe x16, 1 x PCIe x4, 1 x PCI

3C: 3 x PCI

 

PCIe Mini

1 x Full-size (PCIe/ USB 2.0)

1 x Full-size (PCIe/ USB 2.0/ SATA)

 

Power

 

Power Input

DC Jack: 9 V ~ 36 V DC

Terminal Block: 9 V ~ 36 V DC

Power Consumption

19 V@3.44 A (Intel® Core™ i7-6700TE with 8 GB memory)

Internal Power Connector

5V@3A or 12V@3A

 

Reliability

Mounting

Wall mount & DIN Rail

 

Operating Temperature

i7-6700TE -20°C ~ 50°C with air flow (SSD), 10% ~ 95%, non-condensing i5-6500TE -20°C ~ 60°C with air flow (SSD), 10% ~ 95%, non-condensing

 

Storage Temperature

-40ºC ~ 85ºC with air flow (SSD), 5% ~ 90%, non-condensing

Operating Shock

Half-sine wave shock 5G, 11ms, 100 shocks per axis

Non-Operating Shock

Half-sine wave shock 15G, 11ms, 100 shocks per axis

Operating Vibration

MIL-STD-810G 514.6C-1 (with SSD)

Non-Operation Vibration

Half-sind mode IEC-60068-2-06

Weight (Net/Gross)

4.2 kg/6.3 kg

Safety/EMC

CE/FCC/KC

 

OS

 

Supported OS

Microsoft® Windows® 8 Embedded, Microsoft® Windows® Embedded Standard 7 E, Microsoft® Windows® 10 IoT Enterprise

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