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Cincoze DI-1000: high performances with low power consumption

Wednesday, March 8, 2017
The Cincoze DI-1000 series is composed of compact, modular and high performance fanless computers, based on the sixth generation of Intel® Core™ mobile processors (Skylake-U) that integrate Intel® HD graphics and high-performance DDR4 memories supporting up to 16 GB. DI-1000 systems are extremely compact (203 x 142 x 66.8 mm) and offer a particularly rich set of interfaces: DVI-I, DP, 2x LAN, 6x COM, 6x USB, 8x optically isolated DIO, PS/2, Mic-in, Line-Out and remote on/off switch. They integrate two Mini PCI Express slots and two 2.5" bays for HDD/SSD with RAID 0/1 support which make the DI-1000 series unique in terms of performance/size ratio.


 


DI-1000 systems weigh only 1.65 kg and can be installed anywhere thanks to the different types of mounting (VESA, DIN rail, wall mounting, etc.). The CMI (Combined Multiple I/O), CFM (Control Function Module) and MEC (Mini PCI Express) technologies also allow the system to be further expanded with functions such as Multi-LAN, Power-over-Ethernet, Power Ignition and many others. DI-1000 systems are certified according to EN-50155, EN-50121-3-2 and E-mark regulations, which make them suitable for railway and automotive applications.


DI-1000 systems are truly rugged, fanless and cable-free and support operating temperatures of up to -40° + 70° C. They also have a wide range power input from 9 to 48 VDC with over-voltage, over-current and reverse polarity protections; they have been developed to withstand high levels of shocks and vibrations and ensure high levels of MTBF. The DI-1000 series also incorporates SuperCap technology which limits the need for interventions to replace the CMOS battery.

 
  

Below is a summary of the innovative features of the DI-1000 series:

 

High Performances

• Sixth Generation Intel® Core™ Mobile Processor (Skylake-U)
• 14nm Intel® technology with ultra-low power consumption (15W TDP)
• Support for 3 independent displays with 4K Ultra HD resolution
 
Compact Design

• Dimensions: 203 x 142 x 66.8 mm
• Weight: 1.65 kg
 
I/O richness

• DVI, DisplayPort, 2x GbE LAN, 6x COM, 6x USB, 8x Optical Isolated DIO, PS/2
 
Modular Design

• CMI Technology (Combined Multiple I/O) for LAN and Power-over-Ethernet expansions
• CFM Technology (Control Function Module) for "power ignition"
• Mini-PCIe Kits for other I/O expansions
 
Robustness and Reliability

• Operating Temperature -40° +70° C
• Fanless, cable-less and jumper-less design
• Unibody chassis with excellent thermal dissipation
• Shock resistant: Operating, 50 Grms, Half-sine 11 ms Duration
• Vibration resistant: Operating, 5 Grms, 5-500 Hz, 3 Axes
• 100% industrial grade components
• wide range 9-48 VDC power input, with over-voltage, over-current and reverse-polarity protection
• Isolated interfaces
• SuperCap technology to preserve the CMOS battery