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Model Name
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TANK-871-Q170
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Chassis
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Color
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Black C + Silver
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Dimensions (WxDxH) (mm)
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82.2 x 255.2 x 204
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System Fan
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Fanless
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Chassis Construction
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Extruded aluminum alloy
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Motherboard
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CPU
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6th / 7th Gen Intel® Core™ CPU
Intel® Core™ i7-6700TE (2.4 GHz, quad-core, TDP=35W)
Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)
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Chipset
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Intel® Q170
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System Memory
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2 x 260-pin DDR4 SO-DIMM, pre-installed one 4GB (system max: 32GB)
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IPMI
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iRIS solution
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1 x iRIS-2400 (optional)
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Storage
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Hard Drive
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2 x 2.5’’ SATA 6Gb/s HDD/SSD bay (RAID 0/1 support)
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I/O Interfaces
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USB 3.2 Gen 1 (5Gb/s)
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4
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USB 2.0
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4
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Ethernet
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2 x RJ-45
LAN1 (iRIS): Intel® I210 PCIe controller LAN2: Intel® I219LM PCIe controller
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COM Port
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4 x RS-232 (2 x RJ-45, 2 x DB-9 w/2.5kV isolation protection) 2 x RS-232/422/485 (DB-9)
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Digital I/O
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8-bit digital I/O, 4-bit input / 4-bit output
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Display
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1 x VGA, 1 x HDMI+DP, 1 x iDP (optional)
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Resolution
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1 x VGA (up to 1920 x 1200@60Hz)
1 x HDMI/DP (up to 3840x2160@30Hz / 4096×2304@60Hz)
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Audio
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1 x Line-out ; 1 x Mic-in
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Wireless
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1 x 802.11a/b/g/n/ac (optional)
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Expansions
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PCIe Mini
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1 x Half-size (PCIe/ USB 2.0)
1 x Full-size (PCIe/ USB 2.0/ SATA)
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Power
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Power Input
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DC Jack: 9 V ~ 36 V DC
Terminal Block: 9 V ~ 36 V DC
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Power Consumption
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19 V@3.68 A (Intel® Core™ i7-6700TE with 8 GB memory)
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Reliability
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Mounting
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Wall mount
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Operating Temperature/Humidity
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i7-6700TE: -20°C ~ 45°C with air flow (SSD), 10% ~ 95%,non-condensing
i5-6500TE: -20°C ~ 60°C with air flow (SSD), 10% ~ 95%,non-condensing
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Storage Temperature/Humidity
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-40°C ~ 85°C with air flow (SSD), 10% ~ 90%, non-condensing
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Operating Shock
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Half-sine wave shock 5G; 11ms; 100 shocks per axis
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Operating Vibration
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MIL-STD-810G 514.6 C-1 (with SSD)
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Weight (Net/Gross)
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3.5 kg/4.5 kg
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Safety/EMC
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CE/FCC/KC
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OS
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Supported OS
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Microsoft® Windows® 8 Embedded, Microsoft® Windows® Embedded Standard 7 E, Microsoft® Windows® 10 IoT Enterprise
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