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TANK-870-Q170

Sistema PC embedded fanless espandibile (2 o 4 slot) con chipset Intel Q170 e processori 6th/7th gen. Intel Core (Skylake & Kaby Lake)
Caratteristiche
    1. Chipset Intel Q170 e processori 6th/7th gen. Intel Core i5 e i7
    2. 2x LAN, 6x COM, 4x USB 3.0, 4x USB 2.0, 8x Digital I/O
    3. Dual Display: VGA, HDMI/DP
    4. 2x 2.5" SATA HDD/SSD (RAID 0/1), 1x mSATA
    5. 2 slot o 4 slot PCI / PCI Express, 2x Mini PCI Express 
    6. Power Input 9-36 VDC
    7. Temperatura operativa fino a -20° +60° C

 

Produttore:: iEi Integration Corp.

Model Name

TANK-870-Q170

 

Chassis

Color

Black C + Silver

 

Dimensions (WxDxH) (mm)

2-slot: 121.5 x 255.2 x205

4-slot: 154.8 x 255.2 x205

System Fan

Fanless

Chassis Construction

Extruded aluminum alloys

 

Motherboard

 

CPU

6th / 7th Gen Intel® Core™ CPU 

Intel® Core™ i7-6700TE (2.4 GHz, quad-core, TDP=35W)
Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)

Chipset

Intel® Q170

 

System Memory

2 x 260-pin DDR4 SO-DIMM,

one 4 GB pre-installed (system max: 32GB)

IPMI

iRIS Solution

1 x iRIS-2400 (optional)

Storage

Hard Drive

2 x 2.5'' SATA 6Gb/s HDD/SSD bay (RAID 0/1 support)

 

I/O Interfaces

USB 3.2 Gen 1 (5Gb/s)

4

USB 2.0

4

 

Ethernet

2 x RJ-45

LAN1: Intel® I219LM PCIe controller LAN2 (iRIS): Intel® I210 PCIe controller

 

COM Port

4 x RS-232 (2 x RJ-45, 2 x DB-9 w/2.5kV isolation protection) 2 x RS-232/422/485 (DB-9)

Digital I/O

8-bit digital I/O, 4-bit input / 4-bit output

 

Display

1 x VGA

1 x HDMI/DP

1 x iDP (optional)

 

Resolution

1 x VGA (Up to 1920 x 1200@60Hz)

1 x HDMI/DP (Up to 3840x2160@30Hz / 4096×2304@60Hz)

Audio

1 x Line-out, 1 x Mic-in

Wireless

1 x 802.11 a/b/g/n/ac (optional)

TPM

1 x TPM 2.0 (2 x 10 pin) (optional)

 

Expansions

 

Backplane

2-slot model: 1 x PCIe x16, 1 x PCI 2-slot model: 2 x PCIe x8

4-slot model: 2 x PCIe x8, 2 x PCI, 1 x Full-size PCIe Mini (PCIe/ USB 2.0) 4-slot model: 1 x PCIe x16, 3 x PCI, 1 x Full-size PCIe Mini (PCIe/ USB 2.0)

 

PCIe Mini

1 x Half-size (PCIe/ USB 2.0)

1 x Full-size (PCIe/ USB 2.0/ SATA)*

 

Power

 

Power Input

DC Jack: 9 V ~ 36 V DC

Terminal Block: 9 V ~ 36 V DC

Power Consumption

19 V@3.68 A (Intel® Core™ i7-6700TE with 8 GB memory)

Internal Power output

5V@3A or 12V@3A

 

Reliability

Mounting

Wall mount

 

Operating Temperature

i7-6700TE -20°C ~ 45°C with air flow (SSD), 10% ~ 95%, non-condensing i5-6500TE -20°C ~ 60°C with air flow (SSD), 10% ~ 95%, non-condensing

Storage Temperature

-40°C ~ 85°C with air flow (SSD), 10% ~ 90%, non-condensing

Operating Shock

Half-sine wave shock 5G, 11ms, 100 shocks per axis

Operating Vibration

MIL-STD-810G 514.6 C-1 (with SSD)

 

Weight (Net/Gross)

2-slot: 4.2 kg/6.3 kg 4-slot: 4.5 kg/6.5 kg

Safety/EMC

CE/FCC/KC

 

OS

 

Supported OS

Microsoft® Windows® 8 Embedded, Microsoft® Windows® Embedded Standard 7 E, Microsoft® Windows® 10 IoT Enterprise

Model Name

TANK-870-Q170

 

Chassis

Color

Black C + Silver

 

Dimensions (WxDxH) (mm)

2-slot: 121.5 x 255.2 x205

4-slot: 154.8 x 255.2 x205

System Fan

Fanless

Chassis Construction

Extruded aluminum alloys

 

Motherboard

 

CPU

6th / 7th Gen Intel® Core™ CPU 

Intel® Core™ i7-6700TE (2.4 GHz, quad-core, TDP=35W)
Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)

Chipset

Intel® Q170

 

System Memory

2 x 260-pin DDR4 SO-DIMM,

one 4 GB pre-installed (system max: 32GB)

IPMI

iRIS Solution

1 x iRIS-2400 (optional)

Storage

Hard Drive

2 x 2.5'' SATA 6Gb/s HDD/SSD bay (RAID 0/1 support)

 

I/O Interfaces

USB 3.2 Gen 1 (5Gb/s)

4

USB 2.0

4

 

Ethernet

2 x RJ-45

LAN1: Intel® I219LM PCIe controller LAN2 (iRIS): Intel® I210 PCIe controller

 

COM Port

4 x RS-232 (2 x RJ-45, 2 x DB-9 w/2.5kV isolation protection) 2 x RS-232/422/485 (DB-9)

Digital I/O

8-bit digital I/O, 4-bit input / 4-bit output

 

Display

1 x VGA

1 x HDMI/DP

1 x iDP (optional)

 

Resolution

1 x VGA (Up to 1920 x 1200@60Hz)

1 x HDMI/DP (Up to 3840x2160@30Hz / 4096×2304@60Hz)

Audio

1 x Line-out, 1 x Mic-in

Wireless

1 x 802.11 a/b/g/n/ac (optional)

TPM

1 x TPM 2.0 (2 x 10 pin) (optional)

 

Expansions

 

Backplane

2-slot model: 1 x PCIe x16, 1 x PCI 2-slot model: 2 x PCIe x8

4-slot model: 2 x PCIe x8, 2 x PCI, 1 x Full-size PCIe Mini (PCIe/ USB 2.0) 4-slot model: 1 x PCIe x16, 3 x PCI, 1 x Full-size PCIe Mini (PCIe/ USB 2.0)

 

PCIe Mini

1 x Half-size (PCIe/ USB 2.0)

1 x Full-size (PCIe/ USB 2.0/ SATA)*

 

Power

 

Power Input

DC Jack: 9 V ~ 36 V DC

Terminal Block: 9 V ~ 36 V DC

Power Consumption

19 V@3.68 A (Intel® Core™ i7-6700TE with 8 GB memory)

Internal Power output

5V@3A or 12V@3A

 

Reliability

Mounting

Wall mount

 

Operating Temperature

i7-6700TE -20°C ~ 45°C with air flow (SSD), 10% ~ 95%, non-condensing i5-6500TE -20°C ~ 60°C with air flow (SSD), 10% ~ 95%, non-condensing

Storage Temperature

-40°C ~ 85°C with air flow (SSD), 10% ~ 90%, non-condensing

Operating Shock

Half-sine wave shock 5G, 11ms, 100 shocks per axis

Operating Vibration

MIL-STD-810G 514.6 C-1 (with SSD)

 

Weight (Net/Gross)

2-slot: 4.2 kg/6.3 kg 4-slot: 4.5 kg/6.5 kg

Safety/EMC

CE/FCC/KC

 

OS

 

Supported OS

Microsoft® Windows® 8 Embedded, Microsoft® Windows® Embedded Standard 7 E, Microsoft® Windows® 10 IoT Enterprise