❮ ❯ CEM561 COM Express Type 6 Compact, 12th gen. Intel Core (Alder Lake) CharacteristicsDownloadTechnical specificationsCharacteristics 12th gen Intel® Core™ i7/i5/i3 or Celeron® processor(Alder Lake U) Dual channel DDR4-3200 SO-DIMM for up to 64GB Up to 8 lanes of PCI Express 2 SATA Gen3 4 USB 3.0 and 8 USB 2.0 Supports NVMe for up to 512GB (by request) Supports TPM 2.0 Enabler Middleware (eAPI) intelligent remote managementsoftware Get a quote DownloadDownloadDatasheet_CEM561Technical specificationsTechnical specifications CPU Intel® Core™ i7-1265UE/i5-1245UE/i3-1215UE processor or Intel® Celeron® processor 7305E Chipset SoC integrated System Memory 2 x Dual-channel DDR4-3200 SO-DIMM slot, up to 64GB BIOS AMI Serial 1 x LPC 1 x SPI 2 x TX/RX USB 4 x USB 3.0 8 x USB 2.0 Ethernet 1 x 10/100/1000/2500 Mbps Ethernet (Intel® I226-LM) Display 1 x LVDS; 18/24-bit single/dual channel (optional eDP 1.4b HBR3; 5120 x 3200@@60Hz) 1 x VGA; 1920 x 1200 @60Hz (default) 2 x DDI (with up to 8K supported) GPIO 4-CH in & 4-CH out Audio HD link interface to baseboard for Codec Storage 2 x SATA Gen3 NVMe for up to 512GB (optional) Expansion 1 x PCIe x4 Gen4 + 5 x PCIe Gen3 (NVMe SKUs) 2 x PCIe x4 Gen4 + 5 x PCIe Gen3 (without NVMe SKU) Up to 2 x PCIe x4 Gen4 + 8 x PCIe Gen3 (by request) Others 1 x I2C TPM 2.0 Battery Yes Power Input ATX: +12V, +5VSB AT: +12V Watchdog Timer 65536 levels, 0 to 65535 sec. Hardware Monitoring Yes Operating Temperature -40°C to +85°C (-40°F to +185°F) Relative Humidity 10% - 95% relative humidity, non-condensing Vibration 3.5 Grms Dimensions 95 x 95 mm Board Thickness 2.0 mm Certifications CE CharacteristicsDownloadTechnical specifications
