❮ ❯ CEM520 COM Express Type 6 Basic, con processore 8th gen Intel Core (Coffee Lake), 9th gen Intel Core (Coffee Lake Refresh) CharacteristicsDownloadTechnical specificationsCharacteristics Intel® Xeon® & 8th gen Intel® Core™ i7/i5/i3 processors Intel® CM246/QM370/HM370 chipset 2 dual-channel DDR4-2400 SO-DIMM for up to 64GB of memory 1 PCIe x16 and 8 PCIe x1 Gen3 4 SATA Gen3 with RAID 0/1/5/10 4 USB 3.2 and 8 USB 2.0 Supports TPM 2.0 AMS.AXView intelligent remote management software for industrial IoT applications Get a quote DownloadDownloadDatasheet CEM520Technical specificationsTechnical specifications CPU Intel® Xeon® & 8th gen Intel® Core™ i7/i5/i3 processors (Coffee Lake) Chipset Intel® CM246/QM370/HM370 System Memory 2 x DDR4-2666 non-ECC/ECC SO-DIMM, up to 64GB BIOS AMI Serial 1 x LPC 1 x SPI 2 x TX/RX USB 4 x USB 3.2 Gen 2 8 x USB 2.0 Ethernet 1 x 10/100/1000 Mbps Ethernet (Intel® i219-LM) Display 1 x LVDS (optional eDP 1.4: 4096 x 2304 @60Hz) 1 x VGA; up to 1920 x 1200 @60Hz (default) 2 x DDI (DisplayPort 1.2: 4096 x 2304 @60Hz/HDMI 1.4: 4096 x 2160 @30/24Hz) GPIO 4-CH in & 4-CH out (SDIO optional) Audio HD link interface to baseboard for Codec Storage 4 x SATA Gen3 with RAID 0/1/5/10 Expansion 1 x PCIe x16 Gen3 8 x PCIe x1 Gen3 Others 1 x I2C TPM 2.0 Battery N/A Power Input ATX: +12V, +5VSB AT: +12V Watchdog Timer 65536 levels, 0 to 65535 sec. Hardware Monitoring Yes Operating Temperature -40°C to +85°C (-40°F to +185°F) (operation with heatsink and fan) Relative Humidity 10% - 95% relative humidity, non-condensing Vibration 3.5 Grms Dimensions 125 x 95 mm Board Thickness 2.0 mm Certifications CE CharacteristicsDownloadTechnical specifications
