❮ ❯ CEM500 COM Express Type 6 Basic, con processore 6th gen Intel Core (Skylake) CharacteristicsDownloadTechnical specificationsCharacteristics 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H) Intel® CM236/QM170/HM170 chipset 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC 1 x PCIe x16 and 8 x PCIe x1 Gen. 3 4 SATA-600 with RAID 0/1/5/10 4 USB 3.0 and 8 USB 2.0 Intel® AMT 11.0 and TPM function supported AXView 2.0 intelligent remote management software Get a quote DownloadDownloadDatasheet CEM500Technical specificationsTechnical specifications CPU Intel® Xeon® and 6th generation Intel® Core™ processor (Skylake H): E3-1505M v5 (45 W), i7-6820EQ (45 W), i7-6822EQ (25 W), i5-6440EQ (45 W), i3-6100E (35 W) Chipset Intel® CM236/QM170/HM170 System Memory 2 x DDR4-2133 SO-DIMM ECC or non-ECC, up to 32GB BIOS AMI Serial 2 x TX/RX USB 4 x USB 3.0 8 x USB 2.0 Ethernet 1 x 10/100/1000 Mbps (Intel® i219LM) Display 1 x LVDS ;18/24-bit single/dual channel (default), optional with eDP 1 x VGA up to 1920 x 1200 @60Hz (default) 2 x DDI (DP/HDMI/DVI) GPIO 4-IN & 4-OUT Audio HD link interface to baseboard for Codec Storage 4 x SATA-600 with RAID 0/1/5/10 Expansion 1 x PCIe x16 8 x PCIe x1 Others 1 x LPC interface 1 x SPI interface 1 x I2C interface Battery N/A Power Input ATX: +12V, +5VSB AT: +12V Watchdog Timer 65536 levels, 0~65535 sec. Hardware Monitoring Yes Operating Temperature -40ºC ~ +85ºC (-40ºF ~ +185ºF) Relative Humidity 10% ~ 95% relative humidity, non-condensing Dimensions 125 x 95 mm Board Thickness 2.0 mm Certifications CE CharacteristicsDownloadTechnical specifications
