❮ ❯ TANK-XM811 PC embedded fanless espandibile (2 slot) con chipset Intel R680E e processori 12th gen. Intel Core (Alder Lake) CaratteristicheDownloadSpecifiche tecnicheCaratteristiche lntel® Core™ i5-12500TE 1.9GHz (up to 4.3GHz, 6-core, 35W TDP) lntel® Core™ i7 -12700TE 1.4GHz (up to 4.6GHz, 12-core, 35W TDP) 2 x 2.5G Ethernet ports Multiple USB ports and serial ports Multiple internal expansion boards for flexible selection Various optional backplanes and chassis CE/FCC compliant Chiedi un preventivo DownloadDownloadDatasheet TANK-XM811Specifiche tecnicheSpecifiche tecniche ModelName TANK-XM811 Chassis Color BlackC Dimensions (WxDxH) (mm) 230.6 x 256.04 x 76.2 System Fan Fanless Chassis Construction Extruded aluminum alloys Motherboard CPU 12th Gen Intel® Core™ CPU TDP 35/65W Chipset R680E Memory 2 x SO-DIMM DDR4 3200 (8GB pre-installed) (up to 64GB) Storage HDDBay 1 x 2.5” SATA 6Gb/s HDD/SSD bay I/OInterfaces Ethernet 2 x RJ-45, 2 x I225V 2.5GbE (colay I225LM) USB 3.2 Gen 2 (10Gb/s) 8 COM 2 x RS-232/422/485, 4 x RS-232 DigitalI/O 12-bit (6-in/6-out) DB15 Display Interface 1 x DP++, 1 x HDMI InternalExpansions M.2 1 x 2280 M-key (PCIe x4) 1 x 2230 A-key (USB+PCIe x1, supports vPRO) Expansion Backplane Optional Power Power Input 12 ~ 28V DC Remote Power 1 x 2-pin Power Consumption 12V @ 8.8A (Intel®Core™ i9-12900TE with 16GB memory) Reliability Mounting Wallmount Operating Temperature -20°C ~ 60°C with air flow (CPU TDP35W &SSD) -20°C ~ 50°C with air flow (CPU TDP65W &SSD), 10% ~ 95% non-condensing Storage Temperature -40°C ~ 85°C, 10% ~ 95%, non-condensing Operating Shock Half-sine wave shock 5G, 11ms, 100 shocks per axis (SSD) Operating Vibration MIL-STD-810G 514.6C-1 (with SSD) Weight(Net/Gross) 3.33/3.7kg Safety / EMC CE/FCC Watchdog Timer Programmable 1 ~ 255 sec/min OS Supported OS Windows®10/11 IoT Enterprise/ Linux CaratteristicheDownloadSpecifiche tecniche
