Cerca
Filters
Close

conga-TS170

Modulo COM Express type 6 Basic con processori 6th gen. Intel Core (Skylake)
Caratteristiche
  • 6th Generation Intel® Core™ processor
  • Intel® Gen9 HD Graphics with HEVC (H.265) support
  • ECC memory support for Xeon and i3 version
  • Up to 32GByte dual channel DDR4 memory
  • XEON processors for data center applications
Produttore:: Congatec AG

Formfactor: COM Express Basic
CPU    
Intel® Core™ i7-6820EQ (4 x 2.8 / 3.5 GHz, 8MB L2 cache, 45 W)
Intel® Core™ i7-6822EQ (4 x 2.0 / 2.8 GHz, 8MB L2 cache, 25 W)
Intel® Core™ i5-6440EQ (4 x 2.7 / 3.4 GHz, 6MB L2 cache, 45 W)
Intel® Core™ i5-6442EQ (4 x 1.9 / 2.7 GHz, 6MB L2 cache, 25 W)
Intel® Core™ i3-6100E (2 x 2.7 GHz, 3MB L2 cache, 35 W)
Intel® Core™ i3-6102E (2 x 1.9 GHz, 3MB L2 cache, 25 W)
Intel® Xeon™ E3-1505M V5 (4 x 2.8 / 3.7 GHz, 8MB L2 cache, 45 W)
Intel® Xeon™ E3-1505L V5 (4 x 2.0 / 2.8 GHz, 8MB L2 cache, 25 W)
DRAM 2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32GByte dual channel
Chipset Mobile Intel® 100 Series Chipset
Ethernet Intel® i219-LM GbE LAN Controller with AMT 11 support
I/O Interfaces   
8 x PCI Express GEN 3.0 lanes
4 x SATA III
4 x USB 3.0 (XHCI)
8 x USB 2.0
1 x PEG x16 Gen 3
LPC bus
I²C bus
2 x UART
Sound Digital High Definition Audio Interface with support for multiple audio codecs
Graphics Intel® Gen9 HD Graphics Engine
with OpenCL 2.0, OpenGL 4.3 and DirectX12 (Windows 10) support | up to three independent displays: HDMI 1.4a | DisplayPort 1.2 | eDP 1.3 | VGA (optional)
congatec Board Controller
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
embedded BIOS Features
8/16 MByte serial SPI firmware flash
AMI AptioV® UEFI 2.x firmware
Security The conga-TS170 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)
Power Management ACPI 4.0 with battery support
Operating Systems
Microsoft® Windows® 10
Microsoft® Windows® 8.1
Microsoft® Windows® 7
Linux
Microsoft® Windows® embedded Standard
Power Consumption See User's Guide for full details
Temperature Standard Operating: 0 to +60°CStorage: -20 to +80°C
Humidity Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Size 95 x 125 mm (3.74" x 4.92")

Formfactor: COM Express Basic
CPU    
Intel® Core™ i7-6820EQ (4 x 2.8 / 3.5 GHz, 8MB L2 cache, 45 W)
Intel® Core™ i7-6822EQ (4 x 2.0 / 2.8 GHz, 8MB L2 cache, 25 W)
Intel® Core™ i5-6440EQ (4 x 2.7 / 3.4 GHz, 6MB L2 cache, 45 W)
Intel® Core™ i5-6442EQ (4 x 1.9 / 2.7 GHz, 6MB L2 cache, 25 W)
Intel® Core™ i3-6100E (2 x 2.7 GHz, 3MB L2 cache, 35 W)
Intel® Core™ i3-6102E (2 x 1.9 GHz, 3MB L2 cache, 25 W)
Intel® Xeon™ E3-1505M V5 (4 x 2.8 / 3.7 GHz, 8MB L2 cache, 45 W)
Intel® Xeon™ E3-1505L V5 (4 x 2.0 / 2.8 GHz, 8MB L2 cache, 25 W)
DRAM 2 Sockets, SO-DIMM DDR4 up to 2133 MT/s and 32GByte dual channel
Chipset Mobile Intel® 100 Series Chipset
Ethernet Intel® i219-LM GbE LAN Controller with AMT 11 support
I/O Interfaces   
8 x PCI Express GEN 3.0 lanes
4 x SATA III
4 x USB 3.0 (XHCI)
8 x USB 2.0
1 x PEG x16 Gen 3
LPC bus
I²C bus
2 x UART
Sound Digital High Definition Audio Interface with support for multiple audio codecs
Graphics Intel® Gen9 HD Graphics Engine
with OpenCL 2.0, OpenGL 4.3 and DirectX12 (Windows 10) support | up to three independent displays: HDMI 1.4a | DisplayPort 1.2 | eDP 1.3 | VGA (optional)
congatec Board Controller
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | LVDS backlight control I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
embedded BIOS Features
8/16 MByte serial SPI firmware flash
AMI AptioV® UEFI 2.x firmware
Security The conga-TS170 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM 1.2 / 2.0)
Power Management ACPI 4.0 with battery support
Operating Systems
Microsoft® Windows® 10
Microsoft® Windows® 8.1
Microsoft® Windows® 7
Linux
Microsoft® Windows® embedded Standard
Power Consumption See User's Guide for full details
Temperature Standard Operating: 0 to +60°CStorage: -20 to +80°C
Humidity Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.
Size 95 x 125 mm (3.74" x 4.92")

Specifiche di prodotto
Form Factor COM Express Type 6 Basic
Famiglia CPU 6th gen. Intel Core (Skylake)
Specifiche di prodotto
Form Factor COM Express Type 6 Basic
Famiglia CPU 6th gen. Intel Core (Skylake)