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conga-TEVAL/COMe 2.1

Carrier board di sviluppo per moduli COM Express Type 6 Rev 2.1
Caratteristiche
  1. COM Express Type 6 Evaluation Carrier Board
  2. Schematics available
  3. Reference Carrier Board

I/O

  • 6x PCI Express x1
  • 1x Express Card
  • 1x PCI Express Graphics (PEG) x16
  • 1x Mini PCI Express
  • Gigabit Ethernet
  • 2x USB 2.0, 4x USB 3.0, 1x USB client
  • 2x COM, 1x LPT
  • 1x GPIO/SDIO

Audio

  • High Definition Audio Codec

Storage

  • 4x SATA

Misc

  • PCI POST code display
  • System speaker
  • Power button
  • Reset button

Video

  • CRT connector
  • LVDS interface
  • 2x HDMI
  • 2x Display Port
  • 1x DDI / SDVO Slot

Power

  • ATX connector
  • 12V/GND banana jacks
  • CMOS Battery

Size

  • 294 x 244 mm²

Environment

  • Temperature: Operation: 0° to 60°C Storage-20° to + 80°C
  • Humity: Operation: 10% to 90% Storage: 5% to 95%

I/O

  • 6x PCI Express x1
  • 1x Express Card
  • 1x PCI Express Graphics (PEG) x16
  • 1x Mini PCI Express
  • Gigabit Ethernet
  • 2x USB 2.0, 4x USB 3.0, 1x USB client
  • 2x COM, 1x LPT
  • 1x GPIO/SDIO

Audio

  • High Definition Audio Codec

Storage

  • 4x SATA

Misc

  • PCI POST code display
  • System speaker
  • Power button
  • Reset button

Video

  • CRT connector
  • LVDS interface
  • 2x HDMI
  • 2x Display Port
  • 1x DDI / SDVO Slot

Power

  • ATX connector
  • 12V/GND banana jacks
  • CMOS Battery

Size

  • 294 x 244 mm²

Environment

  • Temperature: Operation: 0° to 60°C Storage-20° to + 80°C
  • Humity: Operation: 10% to 90% Storage: 5% to 95%