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TANK-870e-H110

Fanless embedded system with Intel H110 chipset and 6th/7th gen. Intel Core processors (Skylake and Kaby Lake)
Caratteristiche
  1. 6th/7th Gen Intel® Core™ processor 
  2. Intel® H110 chipset and DDR4 memory
  3. Support dual display VGA+HDMI
  4. On-board connector to power add-on cards
  5. Great flexibility for hardware expansion
Manufacturer: iEi Integration Corp.

Cooling method / System Fan

Fanless

Buttons

1 x Power Button
1 x Reset Button
1 x AT/ATX Switch

Operating Temperature

i7-6700TE -20°C ~ 50°C with air flow (SSD)
i5-6500TE -20°C ~ 60°C with air flow (SSD)

Humidity

10% ~ 95%, non-condensing

Construction

Extruded aluminum alloys

Dimensions

132.6 x 255.2 x 190 (WxDxH) (mm)

Weight

4.2 kg/6.3 kg

Color

Dark silver purple + Silver

Expansion Slots

●PCIe Mini:
1 x Full-size PCIe Mini slot
1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
●Backplane:
3A: 1 x PCIe x16, 2 x PCI
3B: 1 x PCIe x16, 1 x PCIe x4, 1 x PCI

SBC Form Factor

●CPU:
Intel 7th Gen Core CPU &
Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)
●Chipset: Intel® H110
●System Memory:
2 x 260-pin DDR4 SO-DIMM, one 4 GB pre-installed (system max: 32GB)
●Power:
Input - DC Jack: 9 V~36 V DC, Terminal Block: 9 V~36 V DC
Consumption: 19 V@3.44 A (Intel® Core™ i7-6700TE with 8 GB memory)
Internal Connector: 5V@3A or 12V@3A
●Reliability:
Operating Shock - Half-sine wave shock 5G, 11ms, 100 shocks per axis
Non-Operating Shock - Half-sine wave shock 15G, 11ms, 100 shocks per axis
Operating Vibration - MIL-STD-810G 514.6C-1 (with SSD)
Non-Operation Vibration - Half-sind mode IEC-60068-2-06
Safety/EMC - CE/FCC

I/O Ports

●USB: 4 x USB 3.0
●Ethernet:
2 x RJ-45 PCIe GbE by RTL8111G controller
●COM Port:
2 x RS-232/422/485 (DB-9, w/ 2.5kV isolation protection)
●Display:
1 x VGA (Up to 1920 x 1200@60Hz)
1 x HDMI 1.4 (up to 3840x2160@30Hz)
●Audio: 1 x Line-out, 1 x Mic-in

Drive Bays

2 x 2.5” SATA 6Gb/s HDD/SSD bay

Download

Cooling method / System Fan

Fanless

Buttons

1 x Power Button
1 x Reset Button
1 x AT/ATX Switch

Operating Temperature

i7-6700TE -20°C ~ 50°C with air flow (SSD)
i5-6500TE -20°C ~ 60°C with air flow (SSD)

Humidity

10% ~ 95%, non-condensing

Construction

Extruded aluminum alloys

Dimensions

132.6 x 255.2 x 190 (WxDxH) (mm)

Weight

4.2 kg/6.3 kg

Color

Dark silver purple + Silver

Expansion Slots

●PCIe Mini:
1 x Full-size PCIe Mini slot
1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
●Backplane:
3A: 1 x PCIe x16, 2 x PCI
3B: 1 x PCIe x16, 1 x PCIe x4, 1 x PCI

SBC Form Factor

●CPU:
Intel 7th Gen Core CPU &
Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35W)
●Chipset: Intel® H110
●System Memory:
2 x 260-pin DDR4 SO-DIMM, one 4 GB pre-installed (system max: 32GB)
●Power:
Input - DC Jack: 9 V~36 V DC, Terminal Block: 9 V~36 V DC
Consumption: 19 V@3.44 A (Intel® Core™ i7-6700TE with 8 GB memory)
Internal Connector: 5V@3A or 12V@3A
●Reliability:
Operating Shock - Half-sine wave shock 5G, 11ms, 100 shocks per axis
Non-Operating Shock - Half-sine wave shock 15G, 11ms, 100 shocks per axis
Operating Vibration - MIL-STD-810G 514.6C-1 (with SSD)
Non-Operation Vibration - Half-sind mode IEC-60068-2-06
Safety/EMC - CE/FCC

I/O Ports

●USB: 4 x USB 3.0
●Ethernet:
2 x RJ-45 PCIe GbE by RTL8111G controller
●COM Port:
2 x RS-232/422/485 (DB-9, w/ 2.5kV isolation protection)
●Display:
1 x VGA (Up to 1920 x 1200@60Hz)
1 x HDMI 1.4 (up to 3840x2160@30Hz)
●Audio: 1 x Line-out, 1 x Mic-in

Drive Bays

2 x 2.5” SATA 6Gb/s HDD/SSD bay