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DS-1102

PC embedded fanless con processori 6th e 7th gen. Intel Core i3 / i5 / i7, Celeron e Pentium (Skylake e Kaby Lake). 2 slot d'espansione PCI o PCI Express
Caratteristiche
  1. Processori 6th e 7th gen. Intel® Core i3 / i5 / i7, Celeron e Pentium con chipset Intel Q170
  2. 2x LAN, 2x COM, 2x USB 2.0, 6x USB 3.0
  3. Triplo Display: 1x DVI-I, 1x DisplayPort, 1x DP/HDMI
  4. Storage: 2x 2.5" SATA HDD/SSD (RAID 0/1), 3x mSATA
  5. Espandibilità: 2x PCI o PCI Express, 3x Mini PCI Express, 1x SIM socket
  6. Power input 9-48 VDC protetto over-current e over-voltage
  7. Temperatura operativa fino a -40° +70° C
  8. Moduli opzionali: 8x DIO isolati, 4x COM, 4x LAN (RJ45 o M12), 4x PoE (RJ45 o M12)
  9. Power Ignition opzionale
  10. Certificato per applicazioni ferroviarie e automotive
Produttore:: Cincoze Co. Ltd.
Model Name
DS-1102
System
Processor
• 7th Generation Intel® CPU (Kaby Lake-S)
- Intel® Core™ i7-7700T Processor (8M Cache, up to 3.8 GHz, 35W TDP)
- Intel® Core™ i5-7500T Processor (6M Cache, up to 3.30 GHz, 35W TDP)
- Intel® Core™ i3-7101TE Processor (3M Cache, 3.40 GHz, 35W TDP)
- Intel® Celeron® G3930TE Processor (2M Cache, 2.70 GHz, 35W TDP)
- Intel® Core™ i7-7700 Processor (8M Cache, up to 4.20 GHz, 65W TDP)
- Intel® Core™ i5-7500 Processor (6M Cache, up to 3.80 GHz, 65W TDP)
- Intel® Celeron® G3930E Processor (2M Cache, 2.90 GHz, 54W TDP)
• 6th Generation Intel® CPU (Skylake-S)
- Intel® Core™ i7-6700TE Processor (8M Cache, up to 3.40 GHz, 35W TDP)
- Intel® Core™ i5-6500TE Processor (6M Cache, up to 3.30 GHz, 35W TDP)
- Intel® Core™ i3-6100TE Processor (4M Cache, 2.70 GHz, 35W TDP)
- Intel® Pentium® Processor G4400TE (3M Cache, 2.40 GHz, 35W TDP)
- Intel® Celeron® Processor G3900TE (2M Cache, 2.30 GHz, 35W TDP)
- Intel® Core™ i7-6700 Processor (8M Cache, up to 4.00 GHz, 65W TDP)
- Intel® Core™ i5-6500 Processor (6M Cache, up to 3.60 GHz, 65W TDP)
- Intel® Core™ i3-6100 Processor (3M Cache, 3.70 GHz, 51W TDP)
- Intel® Pentium® Processor G4400 (3M Cache, 3.30 GHz, 54W TDP)
- Intel® Celeron® Processor G3900 (2M Cache, 2.80 GHz, 51W TDP)
Chipset
Intel Q170
Memory
2x DDR4 2133 MHz SO-DIMM, Up to 32 GB (Un-buffered and Non-ECC)
Graphics
• Integrated Intel® HD Graphics
• Three Independent Display
Audio
Realtek ALC888-GR, High Definition Audio
BIOS
AMI 16 Mbit SPI BIOS
I/O Interface
DVI
1x DVI-I connector, Up to 1920x1080@60Hz
DP
1x DP connector, Up to 3840 x 2160
DP/HDMI
1x DP/HDMI connector, Up to  3840 x 2160
LAN
2x 10/100/1000 Mbps, RJ45
GbE1: Intel I219LM
GbE2: Intel I210AT
Support Wake On Lan, Teaming, Jumbo frame, IEEE 1588v2, PXE
Optional Module
• 4x 10/100/1000 Mbps, RJ45 Port
• 4x 10/100/1000 Mbps, M12 Port
PoE+
Optional Module
• 4x PoE+, Individual port 25.5W, RJ45 Port
• 4x PoE+, Individual port 25.5W, M12 Port
Serial Port
2x RS-232/422/485 with Auto Flow Control Support 5V/12V, DB9
Optional Module
• 4x RS-232/422/485, DB9 Connector
• 4x Electrical Isolated RS-232/422/485, DB9 Connector
USB
• 6x USB 3.0, Type-A
• 2x USB 2.0, Type-A
PS/2 Port
1x PS/2, 6-pin mini-DIN Female Connector
Isolated DIO
Optional Module
• 8x Optical Isolated DIO(4DI, 4DO), 10 pin Terminal Block
Line-Out
1x Line-Out, Phone Jack 3.5mm
Mic-In
1x Mic-In, Phone Jack 3.5mm
Power Button
1x ATX Power On/Off Button
AT/ATX Switch
1x AT/ATX Mode Switch
Clear CMOS Switch
1x Clear CMOS Switch
Remote Power On/Off Connector
1x Remote Power On/Off Connector, 2-pin Terminal Block
Remote Reset Connector
1x Remote Reset Connector, 2-pin Terminal Block
External FAN Connector
1x External FAN Connector, 4-pin Terminal Block
Storage
SSD/HDD
2x 2.5" SATA HDD/SSD bay (Gen3)
One Internal, One Front Accessable
Support RAID 0/1, Hot Swap
mSATA
3x mSATA (Shared by Mini-PCIe Socket) (Gen2)
Expansion
PCI/ PCIe
2x PCI/PCIe Expansion slots
Optional Riser Card
• 1x PCIex16, 1x PCIex1
• 2x PCIex8
• 1x PCIex16, 1x PCI
• 2x PCI
CFM Interface
(Control Function Module) 
1x CFM Interface for CFM Modules
CMI Interface
(Combine Multiple I/O) 
2x CMI Interface for CMI Modules
Mini PCI Express
3x Full-size Mini PCIe
Supports Wireless &  I/O Expansion
Universal I/O Bracket
3x Universal I/O Bracket
SIM Socket
1x SIM Socket
Antenna Holes
2x Antenna Holes
Other
Instant Reboot
Support 0.2sec
Power Ignition Sensing
Optional Module
• CFM with Delay Time Management and Selectable 12V/24V, Dip Switch
Super Cap
Super Cap integrated for CMOS Battery Maintenance-free
Watchdog Timer
Software Programmable Supports 1~255 sec. System Reset
Power Requirement
Power Type
AT/ATX
Power Input Voltage
9~48VDC
Connector
3-pin Terminal Block
Power Adapter
Optional AC/DC Adapter
• AC/DC 24V/5A, 120W
• AC/DC 24V/9.2A, 220W
Physical
Dimension (WxDxH)
227 x 261 x 128 mm
Weight Information
5.7 kg
Mechanical Construction
Extruded Aluminum with Heavy Duty Metal
Mounting
Wall
Unibody Design
Yes
Fanless Design
Yes
Jumper-less Design
Yes
Protection
Reverse Power Input Protection
Yes
Over Voltage Protection
58V
Over Current Protection
15A
ESD Protection
+/-15kV(Air), +/-8kV(Contact)
Surge
3000W
Operating System
Windows
Windows 10
Windows 8.1
Windows 7
Linux
Support by project
Environment
Operating Temperature
7th Generation Intel® CPU (Kaby Lake-S)
- 35W TDP CPU: -40°C to 50°C
- 51W~65W TDP CPU: -40°C to 45°C
6th Generation Intel® CPU (Skylake-S)
- 35W TDP CPU: -40°C to 70°C
- 51~65W TDP CPU: -40°C to 50°C
(With extended temperature peripherals; Ambient with air flow; According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)
Storage Temperature
-40°C to 85°C
Relative Humidity
40°C @ 95% RH (non-Condensing)
Shock
Operating, 50 Grms, Half-sine 11 ms Duration
(w/ SSD, according to IEC60068-2-27)
Vibration
Operating, 5 Grms, 5-500 Hz, 3 Axes
(w/ SSD, according to IEC60068-2-64)
EMC
CE,  FCC Class A
Railway
EN50155, EN50121-3-2
In-Vehicle
E-Mark (E13, No.10R-0514229) Certified
Model Name
DS-1102
System
Processor
• 7th Generation Intel® CPU (Kaby Lake-S)
- Intel® Core™ i7-7700T Processor (8M Cache, up to 3.8 GHz, 35W TDP)
- Intel® Core™ i5-7500T Processor (6M Cache, up to 3.30 GHz, 35W TDP)
- Intel® Core™ i3-7101TE Processor (3M Cache, 3.40 GHz, 35W TDP)
- Intel® Celeron® G3930TE Processor (2M Cache, 2.70 GHz, 35W TDP)
- Intel® Core™ i7-7700 Processor (8M Cache, up to 4.20 GHz, 65W TDP)
- Intel® Core™ i5-7500 Processor (6M Cache, up to 3.80 GHz, 65W TDP)
- Intel® Celeron® G3930E Processor (2M Cache, 2.90 GHz, 54W TDP)
• 6th Generation Intel® CPU (Skylake-S)
- Intel® Core™ i7-6700TE Processor (8M Cache, up to 3.40 GHz, 35W TDP)
- Intel® Core™ i5-6500TE Processor (6M Cache, up to 3.30 GHz, 35W TDP)
- Intel® Core™ i3-6100TE Processor (4M Cache, 2.70 GHz, 35W TDP)
- Intel® Pentium® Processor G4400TE (3M Cache, 2.40 GHz, 35W TDP)
- Intel® Celeron® Processor G3900TE (2M Cache, 2.30 GHz, 35W TDP)
- Intel® Core™ i7-6700 Processor (8M Cache, up to 4.00 GHz, 65W TDP)
- Intel® Core™ i5-6500 Processor (6M Cache, up to 3.60 GHz, 65W TDP)
- Intel® Core™ i3-6100 Processor (3M Cache, 3.70 GHz, 51W TDP)
- Intel® Pentium® Processor G4400 (3M Cache, 3.30 GHz, 54W TDP)
- Intel® Celeron® Processor G3900 (2M Cache, 2.80 GHz, 51W TDP)
Chipset
Intel Q170
Memory
2x DDR4 2133 MHz SO-DIMM, Up to 32 GB (Un-buffered and Non-ECC)
Graphics
• Integrated Intel® HD Graphics
• Three Independent Display
Audio
Realtek ALC888-GR, High Definition Audio
BIOS
AMI 16 Mbit SPI BIOS
I/O Interface
DVI
1x DVI-I connector, Up to 1920x1080@60Hz
DP
1x DP connector, Up to 3840 x 2160
DP/HDMI
1x DP/HDMI connector, Up to  3840 x 2160
LAN
2x 10/100/1000 Mbps, RJ45
GbE1: Intel I219LM
GbE2: Intel I210AT
Support Wake On Lan, Teaming, Jumbo frame, IEEE 1588v2, PXE
Optional Module
• 4x 10/100/1000 Mbps, RJ45 Port
• 4x 10/100/1000 Mbps, M12 Port
PoE+
Optional Module
• 4x PoE+, Individual port 25.5W, RJ45 Port
• 4x PoE+, Individual port 25.5W, M12 Port
Serial Port
2x RS-232/422/485 with Auto Flow Control Support 5V/12V, DB9
Optional Module
• 4x RS-232/422/485, DB9 Connector
• 4x Electrical Isolated RS-232/422/485, DB9 Connector
USB
• 6x USB 3.0, Type-A
• 2x USB 2.0, Type-A
PS/2 Port
1x PS/2, 6-pin mini-DIN Female Connector
Isolated DIO
Optional Module
• 8x Optical Isolated DIO(4DI, 4DO), 10 pin Terminal Block
Line-Out
1x Line-Out, Phone Jack 3.5mm
Mic-In
1x Mic-In, Phone Jack 3.5mm
Power Button
1x ATX Power On/Off Button
AT/ATX Switch
1x AT/ATX Mode Switch
Clear CMOS Switch
1x Clear CMOS Switch
Remote Power On/Off Connector
1x Remote Power On/Off Connector, 2-pin Terminal Block
Remote Reset Connector
1x Remote Reset Connector, 2-pin Terminal Block
External FAN Connector
1x External FAN Connector, 4-pin Terminal Block
Storage
SSD/HDD
2x 2.5" SATA HDD/SSD bay (Gen3)
One Internal, One Front Accessable
Support RAID 0/1, Hot Swap
mSATA
3x mSATA (Shared by Mini-PCIe Socket) (Gen2)
Expansion
PCI/ PCIe
2x PCI/PCIe Expansion slots
Optional Riser Card
• 1x PCIex16, 1x PCIex1
• 2x PCIex8
• 1x PCIex16, 1x PCI
• 2x PCI
CFM Interface
(Control Function Module) 
1x CFM Interface for CFM Modules
CMI Interface
(Combine Multiple I/O) 
2x CMI Interface for CMI Modules
Mini PCI Express
3x Full-size Mini PCIe
Supports Wireless &  I/O Expansion
Universal I/O Bracket
3x Universal I/O Bracket
SIM Socket
1x SIM Socket
Antenna Holes
2x Antenna Holes
Other
Instant Reboot
Support 0.2sec
Power Ignition Sensing
Optional Module
• CFM with Delay Time Management and Selectable 12V/24V, Dip Switch
Super Cap
Super Cap integrated for CMOS Battery Maintenance-free
Watchdog Timer
Software Programmable Supports 1~255 sec. System Reset
Power Requirement
Power Type
AT/ATX
Power Input Voltage
9~48VDC
Connector
3-pin Terminal Block
Power Adapter
Optional AC/DC Adapter
• AC/DC 24V/5A, 120W
• AC/DC 24V/9.2A, 220W
Physical
Dimension (WxDxH)
227 x 261 x 128 mm
Weight Information
5.7 kg
Mechanical Construction
Extruded Aluminum with Heavy Duty Metal
Mounting
Wall
Unibody Design
Yes
Fanless Design
Yes
Jumper-less Design
Yes
Protection
Reverse Power Input Protection
Yes
Over Voltage Protection
58V
Over Current Protection
15A
ESD Protection
+/-15kV(Air), +/-8kV(Contact)
Surge
3000W
Operating System
Windows
Windows 10
Windows 8.1
Windows 7
Linux
Support by project
Environment
Operating Temperature
7th Generation Intel® CPU (Kaby Lake-S)
- 35W TDP CPU: -40°C to 50°C
- 51W~65W TDP CPU: -40°C to 45°C
6th Generation Intel® CPU (Skylake-S)
- 35W TDP CPU: -40°C to 70°C
- 51~65W TDP CPU: -40°C to 50°C
(With extended temperature peripherals; Ambient with air flow; According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)
Storage Temperature
-40°C to 85°C
Relative Humidity
40°C @ 95% RH (non-Condensing)
Shock
Operating, 50 Grms, Half-sine 11 ms Duration
(w/ SSD, according to IEC60068-2-27)
Vibration
Operating, 5 Grms, 5-500 Hz, 3 Axes
(w/ SSD, according to IEC60068-2-64)
EMC
CE,  FCC Class A
Railway
EN50155, EN50121-3-2
In-Vehicle
E-Mark (E13, No.10R-0514229) Certified
Tag del prodotto