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conga-TC570r

COM Express Type 6 Compact module with soldered DRAM and 11th gen. Intel Core processors (Tiger Lake UP3)
Caratteristiche
  • Embedded/Industrial use condition
  • Extended temperature options available
  • PCI Express Gen 4
  • Up to 32 GByte dual channel LPDDR4X soldered down memory with 4266 MT/s IBECC
  • AI/DL Instruction Sets including VNNI
Manufacturer: congatec

Formfactor COM Express Compact

CPU
Intel® Celeron® 6305E (2 x 1.8 GHz, 4MB cache, 15W)
Intel® Core™ i7-1185GRE (4 x 1.8 GHz, 12 MB cache, 15W)
Intel® Core™ i5-1145GRE (4 x 1.5 GHz, 8 MB cache, 15W)
Intel® Core™ i3-1115GRE (2 x 2.2 GHz, 6 MB cache, 15W)

DRAM
Up to 32 GByte LPDDR4X 4266MT/s SDRAM | memory down | dual channel IBECC

Ethernet 1x 2,5GbE TSN Ethernet via Intel® i225

I/O Interfaces
8 x PCI Express GEN 3.0 lanes
PEG support x4 (PCIe Gen4)
4 x USB 3.1 Gen2
8 x USB 2.0
2 x SATA III (6Gb/s)
SPI
2 x UART
8 x GPIOs

Graphics
Integrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4

congatec Board Controller
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection

Security
Trusted Platform Module (TPM 2.0)

Power Management
ACPI 5.0 with battery support

Temperature
Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C

Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Video Interfaces
3x DDI/DP++ | eDP/LVDS | VGA (optional)

Size
95 x 95 mm (3,74" x 3,74")

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Formfactor COM Express Compact

CPU
Intel® Celeron® 6305E (2 x 1.8 GHz, 4MB cache, 15W)
Intel® Core™ i7-1185GRE (4 x 1.8 GHz, 12 MB cache, 15W)
Intel® Core™ i5-1145GRE (4 x 1.5 GHz, 8 MB cache, 15W)
Intel® Core™ i3-1115GRE (2 x 2.2 GHz, 6 MB cache, 15W)

DRAM
Up to 32 GByte LPDDR4X 4266MT/s SDRAM | memory down | dual channel IBECC

Ethernet 1x 2,5GbE TSN Ethernet via Intel® i225

I/O Interfaces
8 x PCI Express GEN 3.0 lanes
PEG support x4 (PCIe Gen4)
4 x USB 3.1 Gen2
8 x USB 2.0
2 x SATA III (6Gb/s)
SPI
2 x UART
8 x GPIOs

Graphics
Integrated Xe (Gen 12) graphics engine with up to 96 EU (Execution Units) | Supporting 4 independent display units (4x 4k/2x 8K) | Enhanced media (AV1/12b) with up to 2 Vdbox | Next Gen IPU6 with DPHY2.1 | DP 1.4

congatec Board Controller
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control | Hardware Health Monitoring | POST Code redirection

Security
Trusted Platform Module (TPM 2.0)

Power Management
ACPI 5.0 with battery support

Temperature
Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C

Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Video Interfaces
3x DDI/DP++ | eDP/LVDS | VGA (optional)

Size
95 x 95 mm (3,74" x 3,74")