The Cincoze DI-1000 series is composed of compact, modular and high performance fanless computers, based on the sixth generation of Intel® Core™ mobile processors (Skylake-U) that integrate Intel® HD graphics and high-performance DDR4 memories supporting up to 16 GB. DI-1000 systems are extremely compact (203 x 142 x 66.8 mm) and offer a particularly rich set of interfaces: DVI-I, DP, 2x LAN, 6x COM, 6x USB, 8x optically isolated DIO, PS/2, Mic-in, Line-Out and remote on/off switch. They integrate two Mini PCI Express slots and two 2.5″ bays for HDD/SSD with RAID 0/1 support which make the DI-1000 series unique in terms of performance/size ratio. DI-1000 systems weigh only 1.65 kg and can be installed anywhere thanks to the different types of mounting (VESA, DIN rail, wall mounting, etc.). The CMI (Combined Multiple I/O), CFM (Control Function Module) and MEC (Mini PCI Express) technologies also allow the system to be further expanded with functions such as Multi-LAN, Power-over-Ethernet, Power Ignition and many others. DI-1000 systems are certified according to EN-50155, EN-50121-3-2 and E-mark regulations, which make them suitable for railway and automotive applications. DI-1000 systems are truly rugged, fanless and cable-free and support operating temperatures of up to -40° + 70° C. They also have a wide range power input from 9 to 48 VDC with over-voltage, over-current and reverse polarity protections; they have been developed to withstand high levels of shocks and vibrations and ensure high levels of MTBF. The DI-1000 series also incorporates SuperCap technology which limits the need for interventions to replace the CMOS battery. Below is a summary of the innovative features of the DI-1000 series: High Performances • Sixth Generation Intel® Core™ Mobile Processor (Skylake-U)• 14nm Intel® technology with ultra-low power consumption (15W TDP)• Support for 3 independent displays with 4K Ultra HD resolution Compact Design • Dimensions: 203 x 142 x 66.8 mm • Weight: 1.65 kg I/O richness • DVI, DisplayPort, 2x GbE LAN, 6x COM, 6x USB, 8x Optical Isolated DIO, PS/2 Modular Design • CMI Technology (Combined Multiple I/O) for LAN and Power-over-Ethernet expansions• CFM Technology (Control Function Module) for “power ignition” • Mini-PCIe Kits for other I/O expansions Robustness and Reliability • Operating Temperature -40° +70° C• Fanless, cable-less and jumper-less design• Unibody chassis with excellent thermal dissipation• Shock resistant: Operating, 50 Grms, Half-sine 11 ms Duration• Vibration resistant: Operating, 5 Grms, 5-500 Hz, 3 Axes• 100% industrial grade components• wide range 9-48 VDC power input, with over-voltage, over-current and reverse-polarity protection• Isolated interfaces• SuperCap technology to preserve the CMOS battery
