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conga-SMX8-Plus

Modulo SMARC 2.1 con processori NXP i.MX 8M Plus
Caratteristiche
  • NXP i.MX 8M Plus 14nm processor series with ARM 4-Core Cortex-A53 / M7 + NPU
  • Enhanced AI, Machine Learning and Vision capabilities featuring NPU and integrated camera ISP’s
  • Ultra low power architecture with 2-6W
  • Support for up to 3 independent displays
  • Extended longevity up to 15 years
  • Temperature range up to -40°C .. +85°C

Formfactor SMARC

CPU
NXP i.MX 8M Plus (4, ARM® Cortex®-A53 @1.6GHz +1x ARM® Cortex®-M7 + NPU)

DRAM Up to 6 GByte onboard LPDDR4 memory | 4000 MT/s | inline ECC

Ethernet 2x Gbit Ethernet with IEEE 1588 Support (1x with TSN support)

I/O Interfaces
1 x dual-role USB 2.0
2 x USB 2.0
2 x USB 3.0
1 x SDIO 3.0
1 x PCIe 3.0
2 x I²C bus
1 x SPI
4 x UART (2x with Handshake)
2 x CAN FD
14 x GPIOs
optional soldered M.2 1216 WiFi/BT

Mass storage eMMC 5.1 up to 128 GByte

Graphics
- Integrated in SoC |
- GC7000UL3D graphics with 2 high performance vec4 shaders | - GC520L 2D graphic |
- supports up to 2x1080p60 or 1x4kp30display resolution |
- Up to 3 independent displaysVPU up to 1080p60 H.265/H.264 decoding and encoding |
- OpenGL ES 3.1 |
- Vu

Security
- Cryptographic Acceleration and Assurance Module
Resource Domain Controller
- ARM® TrustZone®
- High Assurance Boot support
- SHE, Encryption Engine AES-128, AES-256, 3DES, RC4, RSA4096, TRNG SHA-1, SHA-2, SHA-256, MD-5 |
- RSA-1024, 2048, 3072, 4096 and secure key storage |
- side channel attack resistance

Operating Systems
Linux
Yocto
Android

Temperature
Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C

Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Video Interfaces
- 1x dual channel 24 bit LVDS
- 1x HDMI 2.0a
- 1x MIPI-DSI 4-lane shared with second LVDS channel 2x MIPI-CSI 4-lanes
- 2x integrated Image Signal Processor (ISP) for cameras with up to 12 MP resolution

Size 82 x 50 mm (3,23” x 1,97”)

Download

Formfactor SMARC

CPU
NXP i.MX 8M Plus (4, ARM® Cortex®-A53 @1.6GHz +1x ARM® Cortex®-M7 + NPU)

DRAM Up to 6 GByte onboard LPDDR4 memory | 4000 MT/s | inline ECC

Ethernet 2x Gbit Ethernet with IEEE 1588 Support (1x with TSN support)

I/O Interfaces
1 x dual-role USB 2.0
2 x USB 2.0
2 x USB 3.0
1 x SDIO 3.0
1 x PCIe 3.0
2 x I²C bus
1 x SPI
4 x UART (2x with Handshake)
2 x CAN FD
14 x GPIOs
optional soldered M.2 1216 WiFi/BT

Mass storage eMMC 5.1 up to 128 GByte

Graphics
- Integrated in SoC |
- GC7000UL3D graphics with 2 high performance vec4 shaders | - GC520L 2D graphic |
- supports up to 2x1080p60 or 1x4kp30display resolution |
- Up to 3 independent displaysVPU up to 1080p60 H.265/H.264 decoding and encoding |
- OpenGL ES 3.1 |
- Vu

Security
- Cryptographic Acceleration and Assurance Module
Resource Domain Controller
- ARM® TrustZone®
- High Assurance Boot support
- SHE, Encryption Engine AES-128, AES-256, 3DES, RC4, RSA4096, TRNG SHA-1, SHA-2, SHA-256, MD-5 |
- RSA-1024, 2048, 3072, 4096 and secure key storage |
- side channel attack resistance

Operating Systems
Linux
Yocto
Android

Temperature
Industrial: Operating: -40 to +85°C | Storage: -40 to +85°C
Commercial: Operating: 0 to +60°C | Storage: -40 to +85°C

Humidity
Operating: 10 to 90% r. H. non cond. / Storage 5 to 95% r. H. non cond.

Video Interfaces
- 1x dual channel 24 bit LVDS
- 1x HDMI 2.0a
- 1x MIPI-DSI 4-lane shared with second LVDS channel 2x MIPI-CSI 4-lanes
- 2x integrated Image Signal Processor (ISP) for cameras with up to 12 MP resolution

Size 82 x 50 mm (3,23” x 1,97”)