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HTB-100-HM170

Medical Box PC with 6th gen. Intel Core processors (Skylake)
Caratteristiche
  1. Triple independent display with high resolution 
  2. Isolated COM ports for safety among devices
  3. Optional PCIe x16 expansion slot 
  4. Medical grade and fanless
  5. 6th Gen Intel® Core™ processor
  6. Intel® HM170 chipset
Manufacturer: iEi Integration Corp.

Color

Silver + Grayishblue

Dimension(L x Wx H)

294x 209x90.2mm

Thermal

Fanless

ChassisConstruction

Extruded aluminum alloy

CPU

Intel® Core™i7-6822EQ 8MCache, up to2.80 GHz, 25W

Intel® Core™i5-6442EQ 6MCache, up to 2.70GHz,25W

Chipset

Intel® SkylakeHM170

System Memory

1x 4GBpre-installed(system max:32GB)

2x 260-pinDDR4 SO-DIMM

HardDrive

1x 2.5" SATA 6Gb/s HDD/SSDbay

USB

2x USB 2.0

4x USB 3.2Gen1

Ethernet

2x RJ-45 PCIeGbE byIntel® I211 controller

COM port

2x RS-232 (DB-9, with2.5 kV isolation)

2xRS-232/422/485(DB-9,with2.5 kV isolation)

Display

1x VGA, 1 x HDMI 2.0, 1 x iDP (optional)

Resolution

VGA: Upto1920x1200@60Hz

HDMI 2.0: Upto 4096x 2160@60Hz

Audio

Realtek ALC662,5.1-channelHigh Definition Audio(HDA)

1x Line-in, 1 x Lineout,1x Mic-in

Wireless

1x 802.11a/b/g/n/ac 2T2R(optional)

PCIe

1x PCIex16

PCIe Mini

1x Half-sizePCIeMini

1x Full-size PCIeMini(supportsmSATA, colaywithSATA)

M.2

1x1630/2230/3030A-Ekey (PCIe x 2/USB2.0)

Power Input

12~28V DC

Power Consumption

19V@4.4A (Intel® Core™i7-6822EQ with 4GBmemory)

Adapter

Adapter Power; Vin:90~264VAC; Vout:19VDC; 150W

Dim:85 x170 x42.5mm;Plug=6.5mm;Cable=1200mm;Medical;Din4 Pin/lock;CCL;R10

Mounting

Wall mounting

Operating Temperature

0°C~40°Cwithair flow(SSD)

Operating Humidity

10%~95% (non-condensing)

Storage Temperature

-40°C~70°Cwithair flow(SSD)

Storage Humidity

10%~ 90%(non-condensing)

Operating Shock

Half-sinewaveshock5G; 11ms;100shocks peraxis

OperationVibration

MIL-STD-810G 514.6C-1(withSSD)

Weight (Net/ Gross)

2.2kg/ 3.0kg

 

Safety / EMC

CE

IEC62304

IEC60601-1V3.1

IEC60601-1-2V4.0

ISO 14971:2007

FCCclass B part 18

Supported OS

Microsoft® Windows8,Microsoft®Embedded Standard 7

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Color

Silver + Grayishblue

Dimension(L x Wx H)

294x 209x90.2mm

Thermal

Fanless

ChassisConstruction

Extruded aluminum alloy

CPU

Intel® Core™i7-6822EQ 8MCache, up to2.80 GHz, 25W

Intel® Core™i5-6442EQ 6MCache, up to 2.70GHz,25W

Chipset

Intel® SkylakeHM170

System Memory

1x 4GBpre-installed(system max:32GB)

2x 260-pinDDR4 SO-DIMM

HardDrive

1x 2.5" SATA 6Gb/s HDD/SSDbay

USB

2x USB 2.0

4x USB 3.2Gen1

Ethernet

2x RJ-45 PCIeGbE byIntel® I211 controller

COM port

2x RS-232 (DB-9, with2.5 kV isolation)

2xRS-232/422/485(DB-9,with2.5 kV isolation)

Display

1x VGA, 1 x HDMI 2.0, 1 x iDP (optional)

Resolution

VGA: Upto1920x1200@60Hz

HDMI 2.0: Upto 4096x 2160@60Hz

Audio

Realtek ALC662,5.1-channelHigh Definition Audio(HDA)

1x Line-in, 1 x Lineout,1x Mic-in

Wireless

1x 802.11a/b/g/n/ac 2T2R(optional)

PCIe

1x PCIex16

PCIe Mini

1x Half-sizePCIeMini

1x Full-size PCIeMini(supportsmSATA, colaywithSATA)

M.2

1x1630/2230/3030A-Ekey (PCIe x 2/USB2.0)

Power Input

12~28V DC

Power Consumption

19V@4.4A (Intel® Core™i7-6822EQ with 4GBmemory)

Adapter

Adapter Power; Vin:90~264VAC; Vout:19VDC; 150W

Dim:85 x170 x42.5mm;Plug=6.5mm;Cable=1200mm;Medical;Din4 Pin/lock;CCL;R10

Mounting

Wall mounting

Operating Temperature

0°C~40°Cwithair flow(SSD)

Operating Humidity

10%~95% (non-condensing)

Storage Temperature

-40°C~70°Cwithair flow(SSD)

Storage Humidity

10%~ 90%(non-condensing)

Operating Shock

Half-sinewaveshock5G; 11ms;100shocks peraxis

OperationVibration

MIL-STD-810G 514.6C-1(withSSD)

Weight (Net/ Gross)

2.2kg/ 3.0kg

 

Safety / EMC

CE

IEC62304

IEC60601-1V3.1

IEC60601-1-2V4.0

ISO 14971:2007

FCCclass B part 18

Supported OS

Microsoft® Windows8,Microsoft®Embedded Standard 7

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