Microprocessor
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CPU frequency:
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Up to 1 GHz
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Microprocessor:
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AM3352, AM3354, AM3358, AM3359 (Up to 1 GHz)
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Memory
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DDR3L-SDRAM:
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Up to 512 MB
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e-MMC Flash:
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Up to 16 GB
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System interfaces
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CAN:
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Up to 2x CAN 2.0B
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Ethernet 1000BaseT:
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Up to 2x Ethernet 10/100/1000 Mbit (L2 Switch)
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I²C:
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Up to 3x
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McASP:
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Up to 2x (4ch)
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SPI:
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Up to 2x
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UART:
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Up to 6x
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USB:
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2x USB 2.0 high speed OTG interface
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Other interfaces & busses
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ADC:
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Up to 8x 12-Bit
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Debugging:
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CPU JTAG Interface
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GPIO:
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Yes
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PWM:
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Up to 3x
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Graphic
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TFT:
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24-Bit TFT Interface
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General
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Dimensions:
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38 mm x 38 mm
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RoHS:
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Yes
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RTC:
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Yes
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System connector:
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LGA (Land Grid Array) 209 pins
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Power supply:
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3,3 V
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Temperature range:
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-25°C ... +85°C
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Temperature range, extended:
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-40°C ... +85°C
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Temperature sensor:
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Yes
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Availability:
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In production
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Operating systems / User interfaces
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Operating systems:
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Linux, QNX, Windows Embedded Compact 2013
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Operating systems on request:
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VxWorks, Android
|